Part Number: 342100F00000
File Name: thinfin.pdf
No. of Pages: 2
File Size: 53.75 KB
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Abstract:
When space is at a premium, Aavid™s Thin-fin heat sinks reduce package case temperature by as much as 20oC. These flexible, copper spreaders attach to the electronic package using pre-applied adhesive, providing an off-the- shelf solution for PCI and AGP chip sets. A laminated dielectric coating prevents shorting, making the Thin-Fin ideal for BGA devices and multimedia applications.
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