Part Number: CPA241
File Name: CPA241U.pdf
No. of Pages: 1
File Size: 113.1 KB
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Abstract:
SPECIFICATIONS PARAMETER TESTCONDITIONS1 MIN TYP MAX UNITS OFFSET VOLTAGE, initial VS = ±50V 15 40 mV BIAS CURRENT, initial 56 200 pA COMMON MODE REJECTION VCM = ±90 V DC 84 94 dB VOLTAGE SWING IO = 40mA ±VS12 ±VS10 V SUPPLY CURRENT, quiescent VS = ±50 V 1.8 2.1 2.3 mA NOTES: 1. Unless otherwise stated VS = ±50 V, TA = 25°C, DC input specification ± value given. 2. Sample tested by wafer to 95%. TYPICAL EXTERNAL CONNECTIONS DIE LAYOUT * Required component and value if given. Optional balance components are recommended values. CC is NPO, rated for full supply voltage VS to +VS. NOTE: Diagram for connection illustration only. Dimension: 154.5 x 117.5 ± 2.5 Mils. All op amp configurations are possible. Thickness: 15 Mil (380µ). Backside Metal: None, Silicon. Pad Function Pad Function Bond pad: 5 Mil sq (127µ) AI. Make no connection to bond pads not listed by function. 1 O
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