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GSDC165AE 165-Bump BGA (15 mm x 17 mm) Daisy Chain Package

Part Number: GSDC165AE
GSI Technology


Abstract:

This mechanical daisy chain test vehicle is designed to represent the 165-Bump BGA package. It is used for second level interconnect assembly test and continuity verification.


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Other Part Numbers:

GSDC165AE, GSDC165GAE



Other Manufacturers:

Sanken electric Micro Commercial Components Toshiba Semiconductor Winbond
Advanced Linear Devices Teledyne Technologies Inorated InnovASIC, Inc HB Electronic Components
eupec Aeroflex Circuit Technology SanRex Nais(Matsushita Electric Works)

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