Part Number: SMBG5.0A-E3/5B
File Name: smbg.pdf
No. of Pages: 6
File Size: 96.61 KB
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Abstract:
Low profile package, Ideal for automated placement, Glass passivated chip junction, Available in Unidirectional and Bidirectional, 600 W peak pulse power capability with a 10/1000 ?s waveform, repetitive rate (duty cycle): 0.01 %, Excellent clamping capability, Very fast response time, Low incremental surge resistance, Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C, Solder Dip 260 °C, 40 seconds, Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
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