Part Number: SMB10J6.0A
File Name: smb10j5.pdf
No. of Pages: 6
File Size: 104.46 KB
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Abstract:
Low profile package, Ideal for automated placement, Glass passivated chip junction, Available in Unidirectional and Bidirectional, Excellent clamping capability, Very fast response time, Low incremental surge resistance, Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C, Solder Dip 260 °C, 40 seconds, Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
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