RS-232, RS-422 & RS-423 Data Lines,Microprocessor Based Equipment,Control & Monitoring Equipment

Datasheet

Epitaxial Planar Die Construction

The PDN002 is a general purpose ESD array which is well-suited to ensure protection of sensitive IC terminals which may be exposed through pin connections "to the outside world."

M63814P/FP/GP/KP are seven-circuit Single transistor arrays with clamping diodes. The circuits are made of NPN transistors.

M63816P/FP/KP are eight-circuit Single transistor arrays with clamping diodes. The circuits are made of NPN transis- tors. Both the semiconductor integrated circuits perform high-current driving with extremely low input-current supply.

All dimensioning and tolerancing conform to ANSI Y14.5 - 1994. Solder column position designation per Jedec publication 95-1 Standard Procedures and Practices SP-010. "e" represents the basic solder column grid pitch. Dimension b is measured at the maximum solder column diameter, parallel to primary datum. Primary datum and seating plane are defined by the ends of the solder columns. The A1 corner must be indentified on the top surface of the package by using a corner chamfer, ink or

The CA3227 consists of five general purpose silicon NPNtransistors on a common monolithic substrate. Each of thetransistors exhibits a value of fT in excess of 3GHz, makingthem useful from DC to 1.5GHz. The monolithic constructionof these devices provides close electrical and thermalmatching of the five transistors.

The ACS402 belongs to the AC line switches array family built around the ASD concept. This high performance device includes 4 bi-directional a.c. switches able to control an 0.2 A resistive or inductive load device.

System featured Field-Programmable Gate Arrays SelectRAMTM memory: on-chip ultra-fast RAM with Synchronous write option dual-port RAM option Fully PCI compliant (speed grades -2 and faster) Abundant flip-flops Flexible function generators Dedicated high-speed carry logic Wide edge decoders on each edge Hierarchy of interconnect lines Internal 3-state bus capability Eight global low-skew clock or signal distribution networks