Bond
SEMICELL THYRISTOR SKT Tabl. 12,4 Qu RG bond. Corner gate
High current density due to mesa technology. High surge current. Compatible to thick wire bonding.
Relevant Keywords:
"SKTTabl.12,4QuRG"
Related Datasheets:
Gold Wire Bonding Diode
High Voltage.Low Forward Voltage.
Relevant Keywords:
1N60SW, 1N60PW
Related Datasheets:
SEMICELL THYRISTOR SKT Tabl. 15,2 Qu ZG bond. Central gate
High current density due to mesa technology. High surge current. Compatible to thick wire bonding.
Relevant Keywords:
"SKTTabl.15,2QuZG"
Related Datasheets:
Gold Wire Bonding Diode
High Voltage and Low Forward Voltage
Relevant Keywords:
1N60SW, 1N60PW
Related Datasheets:
SEMICELL THYRISTOR SKT Tabl. 18,2 Qu ZG bond. Central gate
High current density due to mesa technology. High surge current. Compatible to thick wire bonding.
Relevant Keywords:
"SKTTabl.18,2QuZG"
Related Datasheets:
Gold Wire Bonding Diode
High Voltage Low Forward Voltage For electronic calculator, etc.
Relevant Keywords:
1N60PWS
Related Datasheets:
SKT Tabl. 5,6 Qu RG bond. Corner gate
High current density due to mesa technology. High surge current. Compatible to thick wire bonding.
Relevant Keywords:
"SKTTabl.5,6QuRG"
Related Datasheets:
Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
Skyworks chips are shipped in plastic chip trays containing up to#400 individual devices. The chips may be removed from the tray#and positioned for inspection or bonding using tweezers or a#vacuum pickup.
Relevant Keywords:
Epo-Tek H31D
Related Datasheets:
100-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond All dimensions and tolerances conform to ASME Y14.5M 1994. Control
Altera Corporation DS-100MBGA-2.2 -- August 2007 1 Altera Device Package Information 100-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond All dimensions and tolerances conform to ASME Y14.5M 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Package Outline Dimension Table Description Specification Symbol Millimeters Ordering Code Reference M Min. Nom. Max. Package Acronym M
Relevant Keywords:
100-Pin
Related Datasheets:
SEMICELL THYRISTOR SKT Tabl. 7,0 Qu RG bond. Corner gate
High current density due to mesa technology. High surge current. Compatible to thick wire bonding.
Relevant Keywords:
"SKTTabl.7,0QuRG"
Related Datasheets:
