The mounting of two devices on an ultra-compact package allows the number of parts and the mounting cost to be reduced. The zener voltage corresponds to the E24 Series. Low Terminal capacitance (between Cathode and Anode) : CT = 6.5 pF (typ.)

N-channel TrenchMOS(TM) transistor, PSMN070-200B; PSMN070-200P,PSMN070-200B PSMN070-200P

The FSA2268 is a high-performance, dual Single Pole Double Throw (SPDT) analog switch that features ultra-low RON of 0.4? (typical) at 3.0V VCC. The FSA2268 operates over a wide VCC range of 1.65V to 4.3V and is designed for break-before-make operation. The select input is TTL-level compatible.

The PI3L301D-A is a 8-Channel, 2:1 multiplexer/demultiplexer LAN Switch. Industry leading advantages include a propagation delay of less than 250ps, resulting from its low channel resistance and I/O capacitance. The device multiplexes differential outputs from a Gigabit Ethernet transceiver (PHY) device to one of two corresponding B1 or B2 outputs.

DescriptionThe ESDAVLC6V1-1BM2 is a monolithic application specific device dedicated to ESD protection of high speed serial interfaces such as USB 2.0, FM antenna, or camera interfaceThe device is ideal for applications where both capability are required. Benefits Very low capacitance for optimized data integrity Very low reverse current < 0.1 ALow PCB space consumption: 0.6 mm2 maxHigh reliability offered by monolithic integrationTM: TRANSIL is a trademark of STMicroelectronicsFunctional dia

DescriptionThe EMIF06-AUD01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.Figure 1.Pin configurationFlip chip package, 20 bumpsMIC1PintGNDIntHOOKGNDPHGBIAS2GNDMIC1NMIC1PMIC2NMIC2PSPK_RSPK_LBIAS1MIC1NintBIAS3MIC2Pi

Features 2 7 · EMI Filtering and ESD Protection Cd Cd · Integration of 20 Discrete Components · Compliance with IEC61000-4-2 (Level 4) 3 6 >8 kV (Contact) Cd Cd · DFN Package, 2 x 2 mm · Moisture Sensitivity Level 1 4 5 · ESD Ratings: Machine Model = C Cd Cd Human Body Model = 3B · This is a Pb-Free Device* (Top View) Benefits MARKING · Reduces EMI/RFI Emmisions on a Data Line DIAGRAM · Integrated Solution Offers Cost and Space Sa

The EMIF06-VID01F2 is a 6 lines highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences.

Eight channels of EMI filtering with integrated ESD protection, Pi-style EMI filters in a capacitor-inductor-capacitor (C-L-C) network, ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge), ±30kV ESD protection on each channel (HBM), Greater than 30dB attenuation (typical) at 1GHz, 16- lead uDFN lead-free package with 0.5mm lead pitch, Tiny 4.00mm x 1.60mm uDFN package size, Increased robustness against vertical impacts during manufacturing process, Lead-

The mounting of two devices on an ultra-compact package allows the number of parts and the mounting cost to be reduced. The zener voltage corresponds to the E24 Series.