Maximum of 0.5% of the total number of components per reel may be missing-exclusively at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components

Glass Passivated Die Construction, High Case Dielectric Strength of 1500VRMS, Low Reverse Leakage Current, Surge Overload Rating to 170A Peak and Ideal for Printed Circuit Board Applications

High surge overload rating of 50 amperes peak, Ideal for printed circuit board and Low forward voltage drop. Glass passivated chip junction.

Low forward voltage drop High current capability High reliability High surge current capability

Superectifier structure for High Reliability condition, Cavity-free glass-passivated junction, Fast switching for high efficiency, Low leakage current, typical IR less than 0.1 ?A, High forward surge capability, Meets environmental standard MIL-S-19500, Solder Dip 260 °C, 40 seconds, Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

Glass Passivated Die Construction, Low Forward Voltage drop and High Current Capability.

Fast switching. Low leakage. Low forward voltage drop. High current capability. High current surge. High reliability

The standard recovery rectifier diode series is military qualified to MIL PRF 19500/411 and is ideal for high reliability applications where a failure cannot be tolerated

Glass Passivated Die Construction Ultra-Fast Switching Low Forward Voltage Drop Low Reverse Leakage Current High Surge Current Capability Plastic Material has UL Flammabilit

UL Recognized file # E-96005, Glass passivated junction, Ideal for printed circuit board, Reliable low cost construction, Plastic material has Underwriters Laboratory Flammability Classification 94V-0, Surge overload rating to 250 amperes, peak High case dielectric strength of 2000 VRMS, Isolated voltage from case to lead over 2500 volts