Ideal for surface mounted applications. Low leakage current. Metallurgically bonded construction. Mounting position: Any. Weight: 0.24 gram

Crystal unit for automotive electronics, Small and low profile (8.0?4.5?1.9mm), Ceramic package, J lead typeProduct with lead free terminations, Reflow compatible.

Daylight viewable. Safety standards - UL and NEMA. Tamperproof / Desighned for high durebility. Long life, lasting up to 100K hours. Uniform illumination - milti-LED construction.Lens options: Low Profile flat Wide angle domed.

The CENTRAL SEMICONDUCTOR CMPT5551HC type is a high current NPN silicon transistor manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high voltage and high current amplifier applications.

Low profile package,Ideal for automated placement,Guardring for overvoltage protection,Low power losses, high efficiency,Low forward voltage drop,High surge capability,Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C,Solder Dip 260 °C, 40 seconds,Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

Absolute Maximum Ratings (Tj = 25Ž) Parameter Symbol Value Unit Total Power Dissipation FR-5 Board at TL=75Ž Derated Above 75Ž PD 500 6.7 mW mW/Ž Thermal Resistance Junction to Ambient Rƒ¦JA 340 Ž/W Thermal Resistance Junction to Lead Rƒ¦JL 150 Ž/W

Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance Lead Free/RoHS Compliant (Note 3) Qualified to AEC-Q101 Standards for High Reliability

Features · Small Compact Surface Mountable Package with J-Bend Leads ULTRAFAST RECTIFIERS · Rectangular Package for Automated Handling 1 AMPERE, 300-400 VOLTS · High Temperature Glass Passivated Junction · Low Forward Voltage Drop (0.8 V Max @ 1.0 A, TJ = 150°C) · Pb-Free Packages are Available Mechanical Characteristics: · Case: Epoxy, Molded · Weight: 70 mg (Approximately) SMA CASE 403D · Finish: All External Surfaces Corrosion Resist

Low Power Loss, High efficiency Glass Passivated chips junction 150ºC Operating Junction Temperature. Low Stored Charge Majority Carrier Conduction Low Forward Voltage Drop, High Current Cabability high- switiching Speed 35 & 50 Nanosecond Recovery Time Small Compact Surface Mountable Package with J-Bend Lead Plastic Material used carries Underwriters Laboratory Flammability Classification 94V-O

Plastic package has Underwriters Laboratory Flammability Classification 94V-O. For surface mounted applications. Low profile package. Built-in strain relief. Metal to silicon rectifier majority carrier conduction. Low power loss, high efficiency. High current capability, low VF. High surge capacity. For use in low voltage high frequency inverters, free wheeling, and polarity protection applications. High temperature soldering guaranteed : 260°C/10 seconds at terminals.