0.160" [4.06 mm] maximum seated height and rugged, molded case construction, Thick film resistive elements, Low temperature coefficient (- 55 °C to + 125 °C) ± 100 ppm/°C, Reduces total assembly costs, Compatible with automatic inserting¾equipment, Wide resistance range (10 ? to 2.2 M?), Uniform performance characteristics, Available in tube pack, Lead (Pb)-free version is RoHS compliant.

High power rating, Low thermal radiation of the case, Wide ohmic value range, Easy mounting, High overload capabilities.

The well known TO-220 package combined with the proven thick film technology provides you, the design engineer, with a high reliable and cost effective solution for applications requiring current limiting/current sensing. The chips unique attachment to the solder coated copper base provides a repeatable low thermal resistance path for the energy to exit the resistor and be dissipated into the heatsink.

Power rating of 1 / 8W. Highly reliable chip resistor Ruthenium oxide dielectric offers superior resistance to the elements. Electrodes not corroded by soldering Thick film makes the electrodes very strong. Leading the world in development and mass production.Since start of production in 1982 (first in the wold), this component has established a solid reputation as a general"purpose chip resistor. ROHM resistors have approved ISO9001- / ISO/TS 16949- certification.Design and specifications

RoHS compliant* (see How to Order "Termination" option),High profile offers increased power handling,Compatible with automatic insertion equipment,Superior package integrity,Marking on contrasting background for permanent identification,Now available with improved tolerance to ±0.5 %

Using its expertise in LSI technology, ROHM has developed new high density driver chips for use in the KD3003-DF10A .Capable of being employed for both thermal and thermal transfer printing, with a print speed of 200mm/s, the resulting print heads are the fastest in their class. The high-speed and high-density printing answers the needs of ATM, kiosk and ticket printing devices, which are increasingly being called upon to produce graphical output.

Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip chip attachment. Their unique construction yields extremely low capacitance and inductance parasitics critical for these high-speed applications.

High pulse performance (during 10 ?s up to 700 W), Metal glaze on high quality ceramic, Protective overglaze, Lead (Pb)-free solder contacts on Ni barrier layer, Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes, Compatible with "Restriction of the use of Hazardous Substances" (RoHS) directive 2002/95/EC (issue 2004), Excellent stability (?R/R ? ± 1 % for 1000 h at 70 °C) in different environmental conditions

Body height: "A" profile = 0.195" [4.95 mm]; "B" profile = 0.295" [7.50 mm], "A" profile standard in 4 thru 12 pins, Thick film resistive elements, Reduces total assembly costs, Resistor elements protected by tough epoxy conformal coating, Wide resistance range (10 ? to 2.2 M?), Available in bulk pack (preferred) or tube pack.

Available with 20 or 30 Watt power rating, Convenient TO220 package, 20 Watt: Resistance range 1 ? to 1 M?, 30 Watt: Resistance range 0.5 ? to 100 k?, Tolerance ± 1 % standard, TCR to ± 50 ppm/°C, Non-Inductive Design.