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Cree, CMPA2560025F 25W, ,2.5-6.0GHz, GaN HEMT MMIC (Cree Wireless), Driver Power Amplifier

DescriptionQtyJ1,J2CONNECTOR, SMA, AMP1052901-12J3HEADER, RT. PLZ. 1, CEN LK, 5 POS1C1,C2,C3CAP, 2400 pF, BROADBAND BLOCK, C08BL242X-5UN-X0T 23C4,C5,C6CAP, 0.1 UF, +/- 10 % , 08053R1RES, 0 OHM, 12061-PCB, TACONIC, RF-35-0100-CH/CH1Q1CMPA2560025F1Notes1 The CMPA2560025F is connected to the PCB with 2.0 mil Au bond wires.2 An external DC Block is required on the input. The output has an interna l DC BlockPRELIMINARY9CMPA2560025F Rev 0.3, PreliminaryCree, Inc.4600 Silicon DriveDurham, NC 27703USA T

Relevant Keywords: 
920pF3, POUTGP-14-dBVDD, CMPA2560025F-Rev0_3, 7CMPA2560025F, POS1C1,C2,C3CAP, CMPA2560025F, 23C4,C5,C6CAP, Inc.4600, C08BL242X-5UN-X0T, PSATPSAT-25-WVDD, 1840pF2, GHz6CMPA2560025F, AMP1052901-12J3HEADER, PSAT3CMPA2560025F, 08053R1RES, CMPA2560025F-TB

100-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond All dimensions and tolerances conform to ASME Y14.5M ­ 1994. Control

Altera Corporation DS-100MBGA-2.2 -- August 2007 1 Altera Device Package Information 100-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond All dimensions and tolerances conform to ASME Y14.5M ­ 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Package Outline Dimension Table Description Specification Symbol Millimeters Ordering Code Reference M Min. Nom. Max. Package Acronym M

Relevant Keywords: 
100-Pin

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