The FS7140 / FS7145 is a monolithic CMOS clock gen-erator/regenerator IC designed to minimize cost and component count in a variety of electronic systems. Via the I 2 C- bus interface, the FS714x can be adapted to many clock generation requirements.

DESCRIPTION AND PURPOSE: This is the FPCN to IPCN 15741 available at www.onsemi.com ON Semiconductor will be manufacturing backend assembly and test process for the Zero Delay Buffer products. Electrical datasheet parameters and specifications will not change. This qualification will allow ON Semiconductor to meet the increasing demand for these types of devices. During the qualification, a design fix was implemented to prevent a potential problem with customer of 0743 or later represents the de

The AMIS-710651-A4 (PI651MC-A4C) is a color contact image sensor (CIS) module. The module contains 15 image-sensor chips, MIS-720058 (PI6058E), a product of AMI Semiconductor. These chips are sequentially cascaded to provide a line array of photo-detectors. Each photo-detector in the image sensor possesses its own independent processing circuit. As the photo-sensors™ digital shift register scans the image sensor chip, it sequentially produces the video signals at the output of the

The AMIS-710239-A3 (PI239MC-A3-R) is a contact image sensor (CIS) module. It is a long contact image sensor, which uses MOS image sensor technology for high speed performance. The AMIS-710239-A3 is suitable for scanning A3 size (307mm) documents with eight dots per millimeter (dpm) resolution. Hence, there are 38 AMIS-720233 (PI3033B) image sensors in the module, providing a total of 2432 pixels in a sequence. The sensors are 200 dots per inch (dpi) solid-state line imaging array, also a

The AMIS-710224-A6 (PI224-MC-A6) is a contact imaging sensor (CIS) module composed of 13 AMIS-720033 (PI3020) image sensor chips. The AMIS-720033 is a 200 dots per inch (dpi) solid-state line imaging array, also a product of AMI Semiconductor. This imaging device is fabricated using MOS imaging sensor technology for high-speed performance and high sensitivity. The AMIS-710224-A6 is suitable for scanning A6 size (104mm) documents with 8 dots per millimeter (dpm) resolution

The AMIS-50051 simplifies the design of the receiver in a direct sequence spread spectrum wireless communication link. The AMIS-50051 uses advanced DSP technology to demodulate the data from a BPSK/DBPSK/QPSK/DQPSK modulated signal. This technique also provides a PN code tracking signal output, a carrier tracking signal and an automatic gain control (AGC) output signal. The power of the AMIS-50051 reduces the complexity and component count of a DSSS receiver. The AMIS-50051 is designed to dem

The N04L163WC1A is an integrated memory device containing a 4 Mbit Static Random Access Memory organized as 262,144 words by 16 bits. The device is designed and fabricated using AMI Semiconductor™s advanced CMOS technology to provide both high-speed performance and ultra-low power.

The A5191HRT is a single-chip, CMOS modem for use in highway addressable remote transducer (HART) field instruments and masters. The modem and a few external passive components provide all of the functions needed to satisfy HART physical layer requirements including modulation, demodulation,receive filtering, carrier detect, and transmit-signal shaping. The A5191HRT is pin-compatible with the SYM20C15. See the Pin Description and Functional Description sections for details on pin compatibility w

description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high

AMI Semiconductor™s AMIS-720442-A (PI3042A) contact image sensor (CIS) is a 400 dots per inch (dpi) linear array image sensor hip. The sensor chip is processed using a CMOS image sensing technology, belonging to AMIS. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the manufacturers to produce variable CIS module lengths in increments of chip array