Small package (dual type).High voltage and high current: VCEO = 50 V, IC = 150 mA (max).High hFE: hFE = 120~400.Excellent hFE linearity: hFE (IC = 0.1 mA)/hFE (IC = 2 mA) = 0.95 (typ.).Complementary to 2SA1873.

Small package by full molding (SIP 12 pin) High collector power dissipation (4-device operation) : PT = 4.4 W (Ta = 25°C) High collector current: IC (DC) = 3 A (max) High DC current gain: hFE = 600 (min) (VCE = 2 V, IC = 1 A)

Lead(Pb)-free products (lead: Sn-Ag-Cu) InGaA?P LED Without stand?offs All plastic mold type Colored lusterless lens Lineup: 3 colors (red, orange, yellow) Suitable for high?brightness and less electricity consumption. All plastic molded lens, provides an excellent on?off contrast ratio. Applications: Backlight, light for decoration, switches, various indicator, personal equipment

Low drain-source ON resistance: RDS (ON) = 72 m? (typ.) High forward transfer admittance: |Yfs| = 4.7 S (typ.) Low leakage current: IDSS =-10 µA (max) (VDS = -20 V) Enhancement-model: Vth = -0.5 to-1.2 V(VDS =-10 V, ID = -200 µA) Low forward voltage: VFM(2) = 0.46V(typ.)

Low distortion at high RF signal input (IIP3): +13dBmW Performance at low Lo signal input: ?5dBmW Double balanced Mix circuit Small package: SM8 (2.9 Æ’" 4.0) Recommended operating voltage: VCC = 4.25~4.75 V

The TD62307P, TD62307F are comprised of seven NPN low saturation drivers. All units feature integral clamp diodes for switching inductive loads and protective diodes against a negative input voltage. Applications include relay, hammer, lamp and LED driver.

Average power dissipation : P = 2.0 W Zener voltage : VZ = 12 V ~ 53 V Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name)

Two devices are incorporated into an Extreme-Super-Mini (6-pin) package. Incorporating a bias resistor into a transistor reduces parts count. Reducing the parts count enables the manufacture of ever more compact equipment and lowers assembly cost.

Repetitive peak reverse voltage: VRRM = 40 V Average output recified current: IO = 30 A Power surface-mount device for thin flat package, "TFP" (Toshiba package name)

The TC7MP3125FK/FTG is a dual supply, advanced high-speed CMOS 4-bit dual supply voltage interface bus transceiver fabricated with silicon gate CMOS technology. It is also designed with over voltage tolerant inputs and outputs up to 3.6 V. Designed for use as an interface between a 1.2-V, 1.5-V, 1.8-V, or 2.5-V bus and a 1.8-V, 2.5-V or 3.6-V bus in mixed 1.2-V, 1.5-V, 1.8-V or 2.5-V/1.8-V, 2.5-V or 3.6-V supply systems. The A-port interfaces with the 1.2-V, 1.5-V, 1.8-V or 2.5-V bus, the B-por