Features EMI Filtering and ESD Protection Integration of 40 Discrete Components Compliance with IEC61000-4-2 (Level 4)> 18 kV (Contact) DFN Package, 1.6 x 4.0 mm Moisture Sensitivity Level 1 ESD Ratings:Human Body Model = 3BMachine Model = C This is a Pb-Free Device*Benefits Reduces EMI/RFI Emissions on a Data Line Integrated Solution Offers Cost and Space SavingsReduces Parasitic Inductances Which Offer a More Ideal Low PassFilter Response Integrated Solution Improves System ReliabilityApplicationsEMI Filtering and ESD Protection for Data LinesWireless Phones Handheld Products Notebook Computers LCD Displays 4321(Bottom View)GND910 11 12876513141516Figure 1. Pin ConnectionsDFN CASE 506ACDevicePackageShippingORDERING INFORMATIONNUF8402MNT4GDFN16(Pb-Free)4000 / Tape & ReelMARKINGDIAGRAM(Top View)1Cd162Cd153Cd144Cd135Cd126Cd 11 7Cd108Cd9For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBroch specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011/D.http://onsemi.com842= Specific Device CodeA= Assembly LocationY= YearW= Work Week = Pb-Free Package1842AYW 116NUF8402MNhttp://onsemi.com2MAXIMUM RATINGSParameterSymbolValueUnitESD Discharge IEC61000-4-2Contact DischargeV PP 18kVOperating Temperature Range T OP-40 to 85CStorage Temperature RangeTSTG-55 to 150CMaximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) TL260CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.ELECTRICAL CHARACTERISTICS (TJ = 25 C unless otherwise noted) ParameterSymbolTest Conditions MinTyp MaxUnitMaximum Reverse Working VoltageVRWM 5.0VBreakdown VoltageV BR IR = 1.0 mA 6.07.0 Semiconductor Components Industries, LL