description of the lead-free solderability tests; results of the solderability testing are shown in Section IV. The reliability data are obtained through the performance of specified accelerated stress tests described in this document. III. APPLICABLE DOCUMENTS All the test procedures and test methods are consistent with industry standards. The standards referenced in this document are JEDEC standard 22. IV. QUALIFICATION TEST PLAN Stress or Test Procedures/Conditions Device Hours/ Cycles Sample Size Failed Units Reference Document Part Tested Preconditioning Level 1 Lead Free External visual 40x High Temp. Storage Life 24 hrs @+125C Temp. & Humidity Test 168 hrs. @ +85C/85% RH Convection Solder Reflow test 3 cycles w/flux immersion, peak temperature 260CN/A 3 lots, a total of 600 parts 0 JESD22-A113C JESD22-A101-B JESD22-B101 JESD22-A103-B J-STD-020B CV210-1F Temperature Cycle Test Condition C Temp. -65C (+0/-10C) to +150C (+10/-0C) Dwell time = 10 to 15 min. 500 cycles 3 lots, a tota Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com 453665-000 September 2004 401 River Oaks Parkway San Jose, CA 95134 A RELIABILITY QUALIFICATION REPORT FOR LEAD-FREE/RoHS COMPLIANT 28-PIN 6x6mm QFN PACKAGED RF SEMICONDUCTORS I. SUMMARY The 28-Pin QFN 6X6 mm package has been lead-free/RoHS qualified to a maximum reflow profile of 260C, and the MSL rating at this reflow profile is level 2. The lead finish is 100% Matte-Tin, 300-800 micro-inches thick and is post plating annealed, bake of 150C for a minimum of 1 hour within 24 hours of plating, to improve solder joint robustness. II. SCOPE This report summarizes the reliability qualification of the 28-Pin QFN 6X6 mm package based on the qualification of the VG101 and CV210-1F. The only difference between leaded (VG101) and the lead-free version (CV210-1F) is with the exterior package plating; the plating on the VG101 SIZE CAGE CODE 14482 DWG. NO. 453665 SCALE