description about device functionalities, as well as ap-plication hints, can be found. Having at hand a copy of the device Data Sheet is essential forquicker and easier understanding of the content of this Application Note.STLC3055N SINGLE SUPPLY SLICFOR WLL APPLICATIONThe STLC3055N is a slic device specially designed for WLL ( Wireless Local Loop) and ISDNTerminal Adapters. It is a feature optimization of the first STLC3055Q generationAN2117/1105Rev. 2AN2117 APPLICATION NOTE2/172PACKAGESTLC3055N is housed in standard TQFP package plastic with copper leadframe. No copperslug surfaces out of the plastic body. STLC3055N uses the package option standard. The thermal resistances, shown in Table 1 and Figure 2, are considered between the junctionand the ambient, in still air, and are calculated or measured in C/W.Table 1. Thermal Resistance versus Package Size2.1TQFP 10 x 10 x1.4Theta (j-a) on boards - STILL AIRFigure 2. Thermal Resistance versus Board Structure.SymbolParameter Value UnitRt feature optimization of the first STLC3055Q generationAN2117/1105Rev. 2AN2117 APPLICATION NOTE2/172PACKAGESTLC3055N is housed in standard TQFP package plastic with copper leadframe. No copperslug surfaces out of the plastic body. STLC3055N uses the package option standard. The thermal resistances, shown in Table 1 and Figure 2, are considered between the junctionand the ambient, in still air, and are calculated or measured in C/W.Table 1. Thermal Resistance versus Package Size2.1TQFP 10 x 10 x1.4Theta (j-a) on boards - STILL AIRFigure 2. Thermal Resistance versus Board Structure.SymbolParameter Value UnitRth j-ambThermal Resistance Junction Ambient (Full plastic TQFP on single layer board)70C/WRth j-ambThermal Resistance Junction Ambient (Full plastic TQFP on four layer board)45C/W3/17AN2117 APPLICATION NOTE3TYPICAL APPLICATION SCHEMATIC Figure 3. 3.1VBAT VOLTAGE GENERATIONThe slic, when operated with a positive supply voltage VPOS and a proper clock signal (typ125KHz), is able to gene 1/17 AN2117APPLICATION NOTE1WIRELESS LOCAL LOO