1/18October 2004VND600-EDOUBLE CHANNEL HIGH SIDE D
DESCRIPTIONThe VND600-E is a monolithic device made usingSTMicroelectronics VIPower M0-3 technology. Itis intended for driving resistive or inductive loadswith one side connected to ground. Active VCC pinvoltage clamp protects the device against lowenergy spikes (see ISO7637 transientcompatibility table).Figure 1. PackageThis device has two channels in high sideconfiguration; each channel has an analog senseoutput on which the sensing current is proportional(according to a known ratio) to the correspondingload current. Built-in thermal shut-down andoutputs current limitation protect the chip fromover temperature and short circuit. Device turns offin case of ground pin disconnection.Table 2. Order CodesNote:(*) See application schematic at page 9TypeRDS(on)I lim V CCVND600-E 35 m W 25 A 36 V SO-16LPackageTubeTape and ReelSO-16LVND600-EVND600TR-EVND600-E 2/18Figure 2. Block DiagramTable 3. Absolute Maximum RatingsSymbolParameterValueUnitV CCDC supply voltage41V-V CCReverse supply voltage Featuresn DC SHORT CIRCUIT CURRENT: 25 A n CMOS COMPATIBLE INPUTS n PROPORTIONAL LOAD CURRENT SENSEn UNDERVOLTAGE AND OVERVOLTAGEn SHUT-DOWN n OVERVOLTAGE CLAMPn THERMAL SHUT DOWNn CURRENT LIMITATIONn VERY LOW STAND-BY POWER DISSIPATIONn PROTECTION AGAINST:n LOSS OF GROUND AND LOSS OF V CC n REVERSE BATTERY PROTECTION (*)n IN COMPLIANCE WITH THE 2002/95/ECEUROPEAN DIRECTIVEDESCRIPTIONThe VND600-E is a monolithic device made usingSTMicroelectronics VIPower M0-3 technology. Itis intended for driving resistive or inductive loadswith one side connected to ground. Active VCC pinvoltage clamp protects the device against lowenergy spikes (see ISO7637 transientcompatibility table).Figure 1. PackageThis device has two channels in high sideconfiguration; each channel has an analog senseoutput on which the sensing current is proportional(according to a known ratio) to the correspondingload current. Built-in thermal shut-down andoutputs current limitation protect the chip fromover temperature and Specifications mentioned in this publication a
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