DescriptionThe EMIF07-LCD02F3 is a 7-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF07 Flip Chip packaging means the package size is equal to the die size.This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV.Figure 1.Pin layout (bump side)Figure 2.Device configuration TM: IPAD is a trademark of STMicroelectronics.Flip Chip(18 bumps)ABCD12345O2O3O4O6I5O5O7I1I2I3I7I6I4GNDGNDGND InputGNDGNDGNDOutputLow-pass FilterRi/o = 70Cline = 30 pFwww.st.comCharacteristicsEMIF07-LCD02F32/8 1 Characteristics Table 1.Absolute maximum ratings (Tamb = 25 C)SymbolParameter and test conditionsValueUnitTjMaximum junction temperature125CT opOperating temperature range-40 to +85CT stgStorage temperature range-55 to 150CTable 2.Electrical characteristics (Tamb = 25 C)SymbolParameters V BRBreakdown voltageI RMLeakage current @ VRM V RMStand-off voltageV Features EMI symmetrical (I/O) low-pass filterHigh efficiency in EMI filteringLead-free packageVery low PCB space occupation:1.42 mm x 1.42 mmVery thin package: 0.65 mm High efficiency in ESD suppressionHigh reliability offered by monolithic integrationHigh reduction of parasitic elements through integration and wafer level packagingComplies with the following standards IEC61000-4-2 level 4 on inputs and outputs:15 kV (air discharge)8 kV (contact discharge)MIL STD 883E - Method 3015-6 Class 3ApplicationsWhere EMI filtering in ESD sensitive equipment isrequired: LCD for mobile phonesComputers and printersCommunication systemsMCU boardsDescriptionThe EMIF07-LCD02F3 is a 7-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF07 Flip Chip packaging means the package size is equal to the die size.This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surg specifications are available at www.st.com.Fig