DescriptionThe EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging That's why EMIF02-MIC06F3 is a very small device.Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15kV.TM: IPAD is a trademark of STMicroelectronics.Figure 1.Pin configuration (bump side)Lead-free Flip-Chip package(8 bumps)BC123AMICBiasECIOpOnnGndAGndMic2pMic2nwww.st.comCharacteristicsEMIF02-MIC06F32/8 1 CharacteristicsFigure 2.Configuration Table 1.Absolute ratings (limiting values)SymbolParameter and test conditionsValueUnitV PPPins B1 and C1:ESD discharge IEC 61000-4-2, level 4air dischargecontact dischargePins A2, A3, B2, B3, C2, C3:ESD discharge IEC61000-4-2, level 1air dischargecontact discharge15 822 kV PDPower dissipation at Tamb = 25 C60mWTjMaximum junction temperature125CT opOperating temperature range- 40 to + 85CTstgSt Features 2-line symmetrical low-pass filterLead-free packageVery low PCB space consuming: < 1.5 mm2Very thin package: 0.65 mmHigh efficiency in ESD suppression IEC 61000-4-2 level 4High reliability offered by monolithic integrationHigh reduction of parasitic elements through Complies with the following standardsIEC 61000-4-2 level 415 kV (air discharge)8 kV (contact discharge)Application Mobile phones (differential microphone filtering and ESD protection)DescriptionThe EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging That's why EMIF02-MIC06F3 is a very small device.Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15kV.TM: IPAD is a trademark of STMicroelectronics.Figure 1.Pin configuration (bump side)Lead-free Flip-Chip package(8 bumps)BC123AMICBiasECIOpOnnGndAGndMic2pMic2nwww.st.comCharacteri specifications are available at w