MDP 01, 03, 05 Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics
0.160" [4.06 mm] maximum seated height and rugged, molded case construction, Thick film resistive elements, Low temperature coefficient (- 55 °C to + 125 °C) ± 100 ppm/°C, Reduces total assembly costs, Compatible with automatic inserting¾equipment, Wide resistance range (10 ? to 2.2 M?), Uniform performance characteristics, Available in tube pack, Lead (Pb)-free version is RoHS compliant.
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