The evolving requirements for high density interconnects has driven Vishay MIC Technology to offer a high volume manufacturing capability to answer our customers needs for cost effective solutions. A dedicated manufacturing cell with the ability to produce in excess of 10 million square inches of circuits per year has been added to Vishay MIC's existing diverse capability. MIC Technologys increasing portfolio of capabilities offers the designer a wide flexibility for meeting the demands of todays markets. Applications in the markets of wireless and fiber optic telecommunication, CATV, medical and military systems are readily solved using MIC Technologys array of design features. This design guide outlines the available toolkit for designing cost-effective volume interconnect solutions. It should be noted that a Vishay MIC Technology sales engineer should work closely with the designer to ensure the most cost-effective solution.