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Failure Mode of SCR-Output Relays vs. MOSFETOutput Relays at High Temperature
High temperature is a common environmental stress in many solid state relay applications. Application engineers must have a solid understanding of how a relay can be expected to fail if the temperature exceeds the rating of the package. This paper aims to compare the theoretical and experimental failure modes of SCR-output relays vs. MOSFET-output relays at high temperature.
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